3M™ 1345 Embossed Tin-Plated Copper Foil Tape
3M™ 1345 3M™ 1345 Embossed Tin-Plated Copper Foil Tape

$11.50 – $425.00 / gulung siap (USD)Lebar tersuai tersedia (deposit $200 ditolak)

Select options This product has multiple variants. The options may be chosen on the product page
Rakan Pemprosesan di Shenzhen Waktu Tempatan: 00:36 UTC+8
YUTO TAPE 3M™ Tape Converting Slitting & Die-Cutting
Rakan Pemprosesan di Shenzhen 00:36 UTC+8
Bahasa:
Beli Bahan →
YUTO TAPE
Shenzhen Converting Facility
USD Export Invoicing
BILIK BERSIH CNC SHENZHEN DALAM TALIAN · gulung induk dalam stok · potong dari 1 gulung
3M™ GENUINE MASTER ROLL · SKU #1345 3M™ Industrial Tape

3M™ 1345 3M™ 1345 Embossed Tin-Plated Copper Foil Tape

3M™ 1345 Embossed Tin-Plated Copper Foil Tape
KETEBALAN · jumlah0.101 mm4.0 mil
SUHU · berterusan-40°C to 130°C (-40°F to 266°F)Julat suhu operasi berterusan
GULUNG INDUK · lebar maks584 mmPotongan tersuai 1–584 mm

$11.50 – $425.00 / gulung siap (USD)Lebar tersuai tersedia (deposit $200 ditolak)

Ketebalan 0.101 mm (4.0 mil) · Suhu -40°C to 130°C (-40°F to 266°F) · 16.5 m setiap gulung · Lebar gulung induk 584 mm · EMI/RFI shielding, excellent solderability and oxidation resistance, PCB grounding
Panjang gulung: 16.5 m / roll

Spesifikasi kejuruteraan gulung induk (TDS)

DOC-TDS-3M-1345
Jumlah ketebalan 0.101 mm (4.0 mil)
Lebar induk maks 584 mm (potongan CNC 1–584 mm)
Julat suhu -40°C to 130°C (-40°F to 266°F)
Penyokong 1.4 mil (0.036 mm) embossed deadsoft copper foil with tin plating
Pelekat Aggressive non-conductive acrylic adhesive
Aplikasi biasa EMI/RFI shielding, excellent solderability and oxidation resistance, PCB grounding
SKU: 3M-1345-584mm165M Category:

3M™ Embossed Tin-Plated Copper Shielding Tape 1345 combines the oxidation resistance and superior solderability of tin plating with 3M's embossed electrical contact technology. The embossed foil teeth penetrate the adhesive barrier, establishing positive electrical contact with the mating surface. Ideal for connector shielding, seam wrapping, and grounding in corrosive or humid operating environments.

Key Performance Highlights

  • Dual-sided tin plating resists oxidation and facilitates direct soldering in harsh climates
  • Embossed backing cuts through adhesive layer establishing immediate low-resistance circuit
  • Excellent shielding effectiveness (>85 dB attenuation across broad RF frequencies)
  • Meets UL 510 flame retardancy and RoHS environmental requirements

Recommended Industrial Applications

Severe-environment grounding, connector backshell shielding, military and communications equipment

Authoritative Technical Specifications

Backing Material 1.4 mil (0.036 mm) embossed deadsoft copper foil with tin plating
Adhesive System Aggressive non-conductive acrylic adhesive
Total Thickness 0.101 mm (4.0 mil)
Operating Temperature -40°C to 130°C (-40°F to 266°F)
Visual Color / Appearance Embossed Silver (Tin-Plated Copper)
Dielectric / Flame Rating UL 510 Recognized Flame Retardant, File E17385
Precision Converting Precision Rotary Slitting, Die-Cutting, Custom Widths from 2mm to Log Width